February, 2010

Intel and Micron unveil denser Flash components

Beth Pariseau Profile: Beth Pariseau

Intel and Micron unveiled a new 25 nanometer lithography process for NAND wafers which are used to build Flash devices on Friday, saying the process will yield denser, cheaper Flash devices for consumers and commercial use. The announcement comes less than a year after 0 Comments     RSS Feed     Email a friend